Музыкальный центр lg ffh 976 инструкция

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SECTION 1. GENERAL

SERVICING PRECAUTIONS

NOTES REGARDING HANDLING OF THE PICK-UP

1. Notes for transport and storage

1) The pick-up should always be left in its conductive bag until immediately prior to use.

2) The pick-up should never be subjected to external pressure or impact.

2. Repair notes

1) The pick-up incorporates a strong magnet, and so should never be brought close to magnetic materials.

2) The pick-up should always be handled correctly and carefully, taking care to avoid external pressure and

impact. If it is subjected to strong pressure or impact, the result may be an operational malfunction and/or

damage to the printed-circuit board.

3) Each and every pick-up is already individually adjusted to a high degree of precision, and for that reason

the adjustment point and installation screws should absolutely never be touched.

4) Laser beams may damage the eyes!

Absolutely never permit laser beams to enter the eyes!

Also NEVER switch ON the power to the laser output part (lens, etc.) of the pick-up if it is damaged.

5) Cleaning the lens surface

If there is dust on the lens surface, the dust should be cleaned away by using an air bush (such as used

for camera lens). The lens is held by a delicate spring. When cleaning the lens surface, therefore, a

cotton swab should be used, taking care not to distort this.

6) Never attempt to disassemble the pick-up.

Spring by excess pressure. If the lens is extremely dirty, apply isopropyl alcohol to the cotton swab. (Do

not use any other liquid cleaners, because they will damage the lens.) Take care not to use too much of

this alcohol on the swab, and do not allow the alcohol to get inside the pick-up.

Storage in conductive bag

Drop impact

NEVER look directly at the laser beam, and don’t let

contact fingers or other exposed skin.

Magnet

How to hold the pick-up

aPressure

Pressure

Cotton swab

Conductive Sheet

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NOTES REGARDING COMPACT DISC PLAYER REPAIRS

1. Preparations

1) Compact disc players incorporate a great many ICs as well as the pick-up (laser diode). These

components are sensitive to, and easily affected by, static electricity. If such static electricity is high

voltage, components can be damaged, and for that reason components should be handled with care.

2) The pick-up is composed of many optical components and other high-precision components. Care must

be taken, therefore, to avoid repair or storage where the temperature of humidity is high, where strong

magnetism is present, or where there is excessive dust.

2. Notes for repair

1) Before replacing a component part, first disconnect the power supply lead wire from the unit

2) All equipment, measuring instruments and tools must be grounded.

3) The workbench should be covered with a conductive sheet and grounded.

When removing the laser pick-up from its conductive bag, do not place the pick-up on the bag. (This is

because there is the possibility of damage by static electricity.)

4) To prevent AC leakage, the metal part of the soldering iron should be grounded.

5) Workers should be grounded by an armband (1MΩ)

6) Care should be taken not to permit the laser pick-up to come in contact with clothing, in order to prevent

static electricity changes in the clothing to escape from the armband.

7) The laser beam from the pick-up should NEVER be directly facing the eyes or bare skin.

CLEARING MALFUNCTION

You can reset your unit to initial status if malfunction occur(button malfunction, display, etc.).

Using a pointed good conductor(such as driver), simply short the RESET jump wire on the inside of the

volume knob for more than 3 seconds.

If you reset your unit, you must reenter all its settings(stations, clock, timer)

NOTE: 1. To operate the RESET jump wire, pull the volume rotary knob and release it.

2. If you wish to operate the RESET jump wire, it is necessary to unplug the power cord.

Armband

Conductive

Sheet

Resistor

(1 Mohm)

Resistor

(1 Mohm)

VOLUME KNOB

UP

DOWN

VOLUME

RESET jump wire

ESD PRECAUTIONS

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components

commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated

circuits and some field-effect transistors and semiconductor chip components. The following techniques should

be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off

any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a

commercially available discharging wrist strap device, which should be removed for potential shock reasons

prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive

surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as «anti-static» can

generate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD

devices.

6. Do not remove a replacement ESD device from its protective package until immediately before you are

ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by

conductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the

protective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL OTHER

SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can

generate static electricity sufficient to damage an ESD device).

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SPECIFICATIONS

1. AMP SECTION

1) Power Output (6 Ω, 2 channel, T.H.D. 10%)

………………………………………….

30W+30W 120W+120W

2) T.H.D 0.2%

…………………………………………………………………………………………….

0.2% 1.0%

3) Frequency Response (-3dB down)

………………………………………………….

700Hz~25kHz 45Hz~700Hz

4) Signal-to-noise Ratio

…………………………………………………………………………………

85dB 75dB

5) Input Sensitivity AUX

……………………………………………………………………..

400±50mV ⋯400±50mV

6) Channel Difference 1kHz

…………………………………………………………………………..

2dB —

2. TUNER SECTION

1) FM/OIRT

1) Frequency Range …………………………………………………………………………………….. 87.5MHz~108MHz

or 65.0MHz~74.0MHz & 87.5MHz~108MHz

2) Intermediate Frequency…………………………………………………………………………………………….. 10.7MHz

3) Sensitivity (70MHz/78.6MHz/83.0MHz/86.6MHz/90MHz/98MHz)…………………………………………. 12dB

4) Signal-to-noise Ratio 98.1MHz(Mono/Stereo)……………………………………………………………. 61dB/58dB

5) Image Rejection 106.1MHz……………………………………………………………………………………….…….. 20dB

6) IF Rejection 90.1MHz …………………………………………………………………………………………..………… 65dB

7) Distortion 98.1MHz(Mono/Stereo)……………………………………………………………………………….. 1.2/1.2%

Frequency Response (-3dB) ………………………………………………………………………………… 60Hz~10kHz

9) Stereo Separation (100Hz/1kHz/10kHz)…………………………………………………………………………… ±23dB

2) AM(MW)

1) Frequency Range……………………………………. 522kHz~1611kHz/530kHz~1610kHz/530kHz~1720kHz

2) Intermediate Frequency………………………………………………………………………………………………. 450kHz

3) Usable Sensitivity…………………………………………………………………………………………….…………….. 55dB

4) Image Rejection (1404kHz) …………………………………………………………………………………………….. 25dB

5) IF Rejection (603kHz)………………………………………………………………………………………….…………. 40dB

6) Selectivity (1008kHz)………………………………………………………………………………………….………….. 23dB

7) Signal-to-noise Ratio (1008kHz)………………………………………………………………………………………. 35dB

Distortion (1008kHz) …………………………………………………………………………………………..………….. 1.5%

9) Frequency Response (1008kHz)……………………………………………………………………….. 100Hz~1800Hz

3) SW(OPTIONAL)

1) Frequency Range…………………………………………………………………………………………… 5.8MHz~18MHz

2) Intermediate Frequency………………………………………………………………………………………………. 450kHz

3) Usable Sensitivity…………………………………………………………………………………………….…………….. 40dB

4) Signal To Noise Ratio………………………………………………………………………………………….…………. 35dB

5) Distortion ………………………………………………………………………………………………………………………… 3%

4) LW(OPTIONAL)

1) Frequency Range………………………………………………………………………………………….. 153kHz~281kHz

2) Intermediate Frequency………………………………………………………………………………………………. 450kHz

3) Usable Sensitivity…………………………………………………………………………………………….…………….. 65dB

4) Signal To Noise Ratio (200kHz)………………………………………………………………………………….……. 28dB

5) Distortion (200kHz) …………………………………………………………………………………………………………… 3%

Main Super Woofer

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3. TAPE DECK SECTION

1) Tape Speed (MTT-111) / Normal Speed ………………………………………………….. 4.75(+2%, -1%)cm/sec

2) Wow Flutter (MTT-111) ………………………………………………………………………………………………… 0.25%

3) Fast Forward and Rewind Time (C-60) ………………………………………………………………………….. 120sec

4) Frequency Response (6dB range) ………………………………………………………………………… 125Hz~8kHz

5) Signal-to-noise Ratio (Playback/Record)…………………………………………………………………… 43dB/43dB

6) Distortion (Playback/Record)………………………………………………………………………………………. 3% / 4%

7) Crosstalk (Playback: 1kHz)……………………………………………………………………………………..………. 55dB

Channel Separation (Playback: 1kHz)…………………………………………………………………………….... 50dB

9) Erase Ratio…………………………………………………………………………………………………………………… 55dB

4. COMPACT DISC PLAYER SECTION

1) Frequency Response (200Hz-18kHz)……………………………………………………………………… +0.5/-3.0dB

2) Signal-to-noise Ratio (1kHz)……………………………………………………………………………………………. 70dB

3) Dynamic Range (1kHz)…………………………………………………………………………………………..………. 70dB

4) T.H.D. (1kHz)………………………………………………………………………………………………………………… 0.2%

5) Separation (100Hz/1kHz/10kHz)……………………………………………………………………… 45dB/45dB/40dB

6) Access Time Short / Long………………………………………………………………………………………... 2sec/5sec

5. GENERAL

1) Power requirement……………………………………………………………………… Refer to the back panel of unit

2) Power consumption ……………………………………………………………………………………………..……….. 170W

3) Dimension (W x H x D)……………………………………………………………………………. 273 x 326 x 360 (mm)

4) Weight (net)………………………………………………………………………………………………….………………. 9.1kg

NOTE : Specification are subject to change without notice in the course of product improvement.

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TAPE DECK ADJUSTMENT

1. AZIMUTH ADJUSTMENT

Figure 1. Azimuth Adjustment Connection Diagram

CH1 CH2

Speaker Out

Playback Mode

Head

Test Tape

MTT-114

L ch

R ch

GND

Dual-trace

synchroscope

Electronic

Voltmeter

L out

R out

Unit

SECTION 2. ELECTRICAL

ADJUSTMENTS

This set has been aligned at the factory and normally will not require further adjustment. As a result, it is not

recommended that any attempt is made to modificate any circuit. If any parts are replaced or if anyone tampers

with the adjustment, realignment may be necessary.

IMPORTANT

1. Check Power-source voltage.

2. Set the function switch to band being aligned.

3. Turn volume control to minimum unless otherwise noted.

4. Connect low side of signal source and output indicator to chassis ground unless otherwise specified.

5. Keep the signal input as low as possible to avoid AGC and AC action.

Deck Mode Test Tape Test Point Adjustment Adjust for

A Deck Playback MTT-114 Speaker Out

DECK Screw

Maximum

Azimuth Screw

B Deck Playback MTT-114 Speaker Out Azimuth Screw Maximum

2. MOTOR SPEED ADJUSTMENT

Figure 2. Motor Speed Adjustment Connection Diagram

Head

Playback Mode

Unit

Speaker Out

GND

L out

R out

Record/Playback

head

Test Tape

MTT-111

Frequency Counter

Deck Mode Test Tape Test Point Adjustment Adjust for Remark

Normal Speed MTT-111 Speaker Out VR201 3kHz ± 1% A Deck

HI-Speed MTT-111 Speaker Out more than 5.4kHz HI-Speed Dubbing Mode